\tQualcomm shelled out $3.1 billion to acquire TDK Electronics\u2019 interest in RF360 Holdings, in a move to bring the RF front-end joint venture completely under its own roof.<\/p>\n
As of last month, TDK Electronics\u2019 remaining stake was valued at $1.15 billion. However, Qualcomm noted in a statement the purchase price also covers its partner\u2019s initial investment, development obligations and payments based on sales by the joint venture.<\/p>\n
Created in 2016, RF360 Holdings was tasked with delivering RF front-end modules and filters [1] for mobile devices and rapidly growing applications spanning IoT, drones and automotive. The idea was to use TDK\u2019s expertise in RF front-end technology to accelerate Qualcomm\u2019s plan to offer fully integrated systems.<\/p>\n
With the purchase, Qualcomm said its RF front-end portfolio now includes the technologies necessary to produce “filters, duplexers, multiplexers for discrete, power amplifiers and diversity modules” along with n-plexers and extractors.<\/p>\n
Qualcomm president Cristiano Amon commented: \u201cOur goal in the formation of this joint venture was to enhance Qualcomm Technologies\u2019 front-end solutions to enable us to deliver a truly complete solution to the mobile device ecosystem, and we have done exactly that.\u201d<\/p>\n
The move comes shortly after Qualcomm announced its Snapdragon X55 5G modem-RF system [2], which it said is the first commercial chipset to combine a modem and RF transceiver and front end with mmWave antenna modules.<\/p>\n[1] https:\/\/www.mobileworldlive.com\/featured-content\/home-banner\/qualcomm-and-tdk-form-components-jv\/
\n[2] https:\/\/www.mobileworldlive.com\/featured-content\/top-three\/qualcomm-pushes-for-mass-market-5g-access\/<\/p>\n","protected":false},"excerpt":{"rendered":"
Qualcomm shelled out $3.1 billion to acquire TDK Electronics’ interest in RF360 Holdings, in a …<\/p>\n
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