The Tensor G3 chip, which is reportedly made by Samsung and is based on its Exynos 2400, could be the first Samsung Foundry chip to incorporate FO-WLP (Fan-out wafer-level packaging) packaging. This enhanced wafer-level packaging will, in theory, allow for better efficiency, improved graphics performance, and more energy being saved.
FO-WLP has been used by Qualcomm and MediaTek, but this is supposedly the first time Samsung Foundry is using the tech.
The 4nm Tensor G3 will be inside the Pixel 8 and Pixel 8 Pro and will have a 9-core CPU – one Cortex-X3 prime core, four…
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